Caractéristiques Clés
High-density interconnect technology
Bifacial dual-glass design
High power output: 655-675W
Efficiency up to 21.7%
Superior PID resistance
Lower temperature coefficient
Spécifications Rapides
Plage de Puissance
655W 660W 665W 670W 675W
Rendement
Up to 21.7%
Détails du Produit
The Vertex D TSM-DE21 series features high-density interconnect technology with bifacial dual-glass construction. These N-type modules deliver powerful 675W output with excellent PID resistance and superior temperature coefficient, making them ideal for diverse environmental conditions.
Détails du Produit
Spécifications Techniques
Technical Highlights
High Density Interconnect
Advanced cell interconnection reduces resistive losses and improves module reliability under mechanical stress
PID Resistance
Enhanced anti-PID technology ensures stable long-term performance even in high-voltage system configurations
Temperature Performance
Lower temperature coefficient maintains higher power output in hot climates, maximizing annual energy generation
Applications Idéales
Commercial and industrial rooftops
Medium to large ground-mount systems
Bifacial installation projects
Challenging environmental conditions
Distributed generation systems